Disco Corporation

Disco makes precision dicing, grinding, and wafer-thinning equipment essential for cutting and preparing wafers, particularly for advanced packaging and chiplet manufacturing. It holds a dominant global share in dicing saws and grinders. The company continues to supply mass-production tools to OSATs and memory makers for AI-related packaging in FY2025.

Ecosystem functionNear-monopoly in precision dicing/grinding, a mechanical step required before advanced packaging of AI chips.

Business modelSells wafer dicing/grinding tools