BE Semiconductor Industries (Besi)

Besi makes die-attach and packaging equipment, including hybrid bonding tools increasingly used for advanced 2.5D/3D chip packaging in AI datacenter chips. It is a leading supplier of assembly equipment to OSATs and IDMs. FY2025 revenue was €591.3 million, down 2.7% year-over-year, though AI-related hybrid bonding and photonics orders rose.

Ecosystem functionKey enabler of hybrid bonding, the advanced packaging technique used to stack HBM and chiplets for AI accelerators.

Business modelSells die-bonding/packaging equipment